MCP23017-E/SP MICROCHIP TECHNOLOGY

IC: expander; 16bit I/O port; I2C; DIP28; 1.8÷5.5VDC

TME Symbol: MCP23017-E/SP
Manufacturer part number: MCP23017-E/SP
Documentation: (1)
Catalogue description: details
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Min. amount: 1
Multiplicity: 1
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Additional information
Additional information
Specification
Technical Information (1)
Multimedia
MICROCHIP TECHNOLOGY
expander
16bit I/O port
I2C
DIP28
1.8...5.5V DC
THT
1.7Mbps
  • Gross weight: 2.15 g
  • Manufacturer part number: MCP23017-E/SP

Components which are sensitive to electrostatic discharges are packed with due caution in special ESD zone. For this purpose, we use antistatic rails or blisters filled with antistatic ether foam. All products from ESD zone are also packed in shielding bags.

Documentations and manuals

The documentation is not updated automatically, but we make every effort to provide the latest versions of the documents.

D-PZ12
Tool: for demounting of ICs; DIP; 38mm
| INFO
Manufacturer: DONAU ELEKTRONIK
Manufacturer part number: PZ12
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Multiplicity: 1
Min. amount: 1
Type of integrated circuit socket: DIP (14)
ICVT-28P-W
Socket: DIP; PIN: 28; 7.62mm; THT; Pitch: 2.54mm
| INFO
Manufacturer: CONNFLY
Manufacturer part number: DS1009-28AT1NS
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Multiplicity: 1
Min. amount: 10
GOLD-28P-W
Socket: DIP; PIN: 28; Pitch: 2.54mm; precision; THT; gold-plated
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Manufacturer: CONNFLY
Manufacturer part number: DS1001-01-28BT1NSF6S
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Multiplicity: 1
Min. amount: 2
GOLD-28P
Socket: DIP; PIN: 28; Pitch: 2.54mm; precision; THT; gold-plated
| INFO
Manufacturer: CONNFLY
Manufacturer part number: DS1001-01-28BT1WSF6S
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Multiplicity: 1
Min. amount: 2
Type of board: universal (7)
MS-DIP/SMD1
Board: universal; single sided,prototyping; W: 60mm; L: 100mm
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Multiplicity: 1
Min. amount: 1
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