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maxiFLOW™ series of heat sinks by Advanced Thermal Solutions

2020-10-19

Heat sinks are basic elements used to dissipate heat from electronic circuits. Proper temperature control contributes tolonger durability of devices or even to users’ safety. That is why TME offers a wide choice of proven and effective heat sinks from world-renowned manufacturers. One such manufacturer is, for example, Advanced Thermal Solutions, whose products are described below.

The design of products from the maxiFLOW™series (compared to heat sinks with a different structure) ensures the highest efficiency of heat dissipation in relation to their physical volume. maxiFLOW™ heat sinks are perfectly suitable to be used with a wide range of semiconductor circuit housings such as: BGA, QFP, LCC, LGA, CLCC, TSOP, DIP and LQFP. In addition, maxiFLOW™ series can be equipped with two innovative clamping systems: maxiGRIP™ and superGRIP™.

Advanced Thermal Solutions heat sinks find their application anywhere where heat dissipation from electronic components is required, protecting them from thermal damage.

ATS-50350G-C1-R0 Heat sink: ATS-50350G-C1-R0

Specification:
Heat sink type: moulded
Heat sink shape: ribbed
Material: aluminium
Width: from 15mm to 118mm

See the maxiFLOW™ series products

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