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maxiFLOW™ series of heat sinks by Advanced Thermal Solutions


Heat sinks are basic elements used to dissipate heat from electronic circuits. Proper temperature control contributes tolonger durability of devices or even to users’ safety. That is why TME offers a wide choice of proven and effective heat sinks from world-renowned manufacturers. One such manufacturer is, for example, Advanced Thermal Solutions, whose products are described below.

The design of products from the maxiFLOW™series (compared to heat sinks with a different structure) ensures the highest efficiency of heat dissipation in relation to their physical volume. maxiFLOW™ heat sinks are perfectly suitable to be used with a wide range of semiconductor circuit housings such as: BGA, QFP, LCC, LGA, CLCC, TSOP, DIP and LQFP. In addition, maxiFLOW™ series can be equipped with two innovative clamping systems: maxiGRIP™ and superGRIP™.

Advanced Thermal Solutions heat sinks find their application anywhere where heat dissipation from electronic components is required, protecting them from thermal damage.

ATS-50350G-C1-R0 Heat sink: ATS-50350G-C1-R0

Heat sink type: moulded
Heat sink shape: ribbed
Material: aluminium
Width: from 15mm to 118mm

See the maxiFLOW™ series products


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