Board: universal; MS-DIP/SO10; SOLDER PEAK

Board: universal; MS-DIP/SO10; SOLDER PEAK, MS-DIP/SO10 |EN|
Type of boarduniversal
Boardsingle sided, prototyping
MaterialFR4, fiberglass, epoxy resin
Laminate thickness1mm
Copper plating thickness18µm
Length21mm
Width15.5mm
Hole diameter1mm
Soldering pads pitch2.54mm
Soldering pads configurationDIP10;
DIP12;
DIP14;
DIP16;
DIP4;
DIP6;
DIP8;
SO10;
SO14;
SO16;
SO4;
SO6;
SO8
Symbol Product description
MS-DIP/SO10 Board:universal;single sided,prototyping;W:15.5mm;L:21mm
logo icon

Transfer Multisort Elektronik Sp. z o.o.

ul. Ustronna 41, 93-350 Łódź, Poland
NIP: 729-010-89-84, VAT UE: PL7290108984
District Court for Łódź-Śródmieście in Łódź
KRS:0000165815
Amount of share capital: 3 300 000 PLN

Contact us:
Tel.: +48 42 645 54 44
Fax.: +48 42 645 54 70
E-mail: [email protected]

Product Information Management: www.parcat.eu