Development kits for MEIG SMART communication modules

Symbol Development kit Components Connection
MEIG-EVB-KIT evaluation - D-Sub 9pin x2, pin header, solder pads, SIM, USB, power supply
MEIG-EVB-KIT-M828 evaluation - D-Sub 9pin x2, solder pads, RJ11, SD, SIM x2, USB
SLM156-EVB-KIT IoT SLM156 D-Sub 9pin x2, pin header, nanoSIM, USB x2
SLM326-EVB-KIT evaluation - -
SRM815-EVB-KIT LTE SRM815 antenna socket, solder pads, RJ11, RJ45, SD, SIM, USB, power supply
SRM825N-EVB-KIT evaluation - -
ManufacturerMEIG SMART TECHNOLOGY
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Transfer Multisort Elektronik Sp. z o.o.

ul. Ustronna 41, 93-350 Łódź, Poland
NIP: 729-010-89-84, VAT UE: PL7290108984
District Court for Łódź-Śródmieście in Łódź
KRS:0000165815
Amount of share capital: 3 300 000 PLN

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E-mail: [email protected]

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