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Manufacturer | AG TERMOPASTY | |
Type of solder | solder paste | |
Appearance | paste | |
Kind of solder | lead free | |
Alloy composition | Sn96,5Ag3Cu0,5 | |
Kind of package | syringe | |
Grain size | 25...45µm | |
Binder weight | 6g | |
Melting point | 217°C | |
Flux content | 12% | |
Kind of flux | halide-free, No Clean, REL0 | |
Signal word | Warning | |
Version | for soft soldering | |
Flux residues | non-corrosive, transparent, yes |