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Date of publication: 13-04-2026 🕒 5 min read
Thermal paste is an essential element of the heat dissipation system, as by lowering the temperature, it affects the stability of the system's operation and its overall performance. The best example is its crucial role in cooling the processor. Thermal paste acts as a conductive layer between the processor and the radiator. Without it, air pockets would form between these surfaces, negatively affecting heat dissipation, as air is a poor conductor. Thanks to the use of paste, the operating temperature of the processor decreases, which translates into better performance.
The range of thermal pastes from AG TermoPasty varies mainly in chemical composition and application. When choosing the right paste, it is worth paying attention to aspects such as thermal conductivity, product density, ease of application, and above all, durability.
Thermal conductivity is one of the key parameters of thermal pastes. It is measured in W/mK (watts per meter and Kelvin). The higher the value, the more effectively the paste will dissipate heat. The basic element determining thermal conductivity is the chemical composition of the product. AG TermoPasty offers metallic pastes with additions of copper, silver, or gold, and silicone pastes, differing in properties and applications.
Metallic pastes are ideal where very good heat dissipation is crucial, such as in cooling electronic systems. Silicone thermal pastes are characterized by lower thermal conductivity. They are therefore dedicated to mechanical devices, where stability and resistance to working conditions are very important.
Thermal pastes, depending on their density, can be more viscous or more fluid, which is crucial during the application of the paste. Those with higher density are more difficult to spread evenly. However, it should be remembered that in the case of low-density pastes, there is a greater risk of leakage beyond the working surface. In the case of metallic pastes, such leakage can be particularly dangerous, as they conduct electricity, and such a fault can lead to system damage.
Thermal tapes provide a convenient alternative to pastes in applications requiring quick and clean mounting of heat-dissipating components. These materials combine the function of conducting heat with mounting properties. Thanks to the self-adhesive layer, they enable permanent attachment of radiators, LED modules, converters, or integrated circuits without the need for additional mechanical elements. Tapes fill the micro-gaps between contact surfaces, improving heat transfer while providing electrical insulation and mechanical stability of the connection. This solution is particularly well-suited for compact devices, consumer electronics, and LED applications, where quick assembly and repeatability of the production process are important.
As with pastes, one of the most important parameters when choosing thermal tapes is thermal conductivity, measured in W/mK. The higher this coefficient, the more effective the heat dissipation from the component to the radiator or device casing. Besides conductivity, the thickness of the material is also important, affecting the ability to fill surface irregularities (from 0.3mm to 3mm), as well as adhesive properties ensuring stable mounting of components. In many applications, electrical insulation and resistance of the material to elevated temperatures and aging are also important. Therefore, the selection of the right tape should consider both thermal parameters and the working conditions of the device, as well as the method of mounting cooling elements.
AG TermoPasty's offer is not limited to thermal pastes and tapes. The manufacturer also provides a wide selection of service and operational preparations for electronics, which support both assembly and maintenance of devices. The catalog includes, among others, electronic cleaning fluids, used to remove residues of pastes, fluxes, dust, or other contaminants from the surfaces of PCBs and electronic components. TME also offers freezers, used during the diagnostics of electronic systems, enabling quick localization of components prone to overheating or reacting to temperature changes.
Complementing the range are preparations for cleaning and regenerating contacts, which improve electrical conductivity in connectors and switches, as well as agents designed for protection and maintenance of electronic components. Thanks to such a wide range of products, AG TermoPasty can be used not only to improve heat dissipation from components but also for comprehensive service support of electronic devices – from cleaning and diagnostics to their protection and maintenance in good operational condition.
The wide range of AG TermoPasty – including thermal pastes and tapes as well as service preparations for electronics – allows for the selection of appropriate solutions both for effective heat dissipation and for comprehensive maintenance and diagnostics of electronic devices.